Imveliso ye-Dolphin0606FDI luhlobo olusisigxina kunye nesandi esisezantsi x-reyi yesibonisi sepaneli esekwe kwiCMOS.Izinzwa zeCMOS zisebenzisa inkqubo enye ye-silicon yekristale ukwenza i-chip.Ukwandiswa okuthe ngqo okudityanisiweyo ngaphakathi kweeseli ze-pixel kukhokelela kwingxolo ephantsi ye-elektroniki, umlinganiselo ophezulu wesignali ukuya kwingxolo, kunye nomgangatho ophezulu wokubonwa kwe-quantum (DQE) kune-silicon ye-amorphous, ngoko ke izinzwa ze-CMOS zifanelekele ngakumbi iimeko zokucinga zedosi ephantsi.Ngokusekelwe kwiimpawu ezingentla, i-Dolphin0606FDI detector ingasetyenziswa ngokubanzi kwi-SMT yoshishino, i-electronics, ibhetri ye-lithium kunye nokuhlolwa kwe-chip wire bonding.
Ingxolo yombane iphantsi
Umlinganiselo ophezulu wophawu ukuya kwingxolo
| Iteknoloji | |
| Isivamvo | CMOS |
| I-scintillator | CSI |
| Indawo esebenzayo | 60 x 53.5 mm |
| I-Pixel Matrix | 1200 x 1056 |
| I-Pixel Pitch | 50 μm |
| Ukuguqulwa kwe-AD | 14 bits |
| Ujongano | |
| INxibelelwano yoNxibelelwano | IFayibha yokubona |
| Ulawulo lokutyhileka | I-Pulse Sync ngaphakathi (Edge okanye iNqanaba) / Pulse Sync Out (Edge okanye iNqanaba) |
| Imo yokusebenza | Imowudi yeSofthiwe / Imowudi yeHVG Sync / FPD Sync Imowudi |
| Isakhelo sesantya | 51fps (1x1) |
| Inkqubo yokwenza | Windows7 / Windows10 OS 32 bits okanye 64 bits |
| Ukusebenza kwezobuGcisa | |
| Isigqibo | 10.0 lp/mm |
| Uluhlu lwamandla | 40 ~ 160 KV |
| Lag | 0.01% @1st isakhelo |
| Uluhlu olunamandla | ≥ 73dB |
| Uvakalelo | 100 lsb/uGy |
| SNR | 48 dB @(20000lsb) |
| MTF | 90% @(1 lp/mm) |
| 82% @(2 lp/mm) | |
| 74% @(3 lp/mm) | |
| I-DQE (2uGy) | 65% @(0 lp/mm) |
| 48% @(1 lp/mm) | |
| 37% @(2 lp/mm) | |
| Oomatshini | |
| Ubungakanani(H x W x D) | 171 x 171 x 37 mm |
| Ubunzima | 2.8 Kg |
| Isixhobo soKhuseleko lweSensom | I-Carbon Fiber |
| Izinto Zezindlu | Ingxubevange yeAluminiyam |
| Okusingqongileyo | |
| Uluhlu lobushushu | 10 ~ 35 ° ℃ (isebenza);-10~50℃(ugcino) |
| Ukufuma | 30 ~ 70% RH(engacondensing) |
| Ukungcangcazela | IEC/EN 60721-3 iklasi 2M3(10~150 Hz,0.5 g) |
| Umothuko | IEC/EN 60721-3 iklasi 2M3(11 ms,2 g) |
| Ukuxhathisa uthuli naManzi | IPX0 |
| Amandla | |
| Ubonelelo | 100 ~ 240 VAC |
| Ukuphindaphinda | 50/60 Hz |
| Ukusetyenziswa | 6 W |
| Isicelo | |
| Imizi-mveliso | I-SMT, i-Electronics, ibhetri yeLithium Chip Wire Bonding Uhlolo |
| Mechanical Dimension | |